BTQ Technologies and ICTK Complete Design of Next-Generation QCIM Security Chip Integrating PUF Technology
BTQ Technologies (Nasdaq: BTQ) said it completed the design of a next-generation QCIM + PUF security chip with ICTK Co. (KOSDAQ: 456010). The chip combines BTQ’s QCIM cryptographic accelerator IP with ICTK’s VIA PUF technology for hardware-rooted device authentication and crypto agility. Production prep is underway, and BTQ expects to ship test chips to customers by year-end.
How this was made

The 30-second read
Why it matters
The newest disclosed fact is completion of the next-generation QCIM plus PUF chip design and the start of production preparation, with test chips planned for shipment to key customers by year-end.
Market read
This is a technical development milestone that can shift expectations for deployable quantum-era security silicon, but it does not provide financial metrics or validation results yet.
What to watch
Key gating items are test-chip outcomes, customer qualification timelines, and whether QCIM plus PUF integration meets power, latency, and cryptographic-agility targets required for regulated deployments.
Background
BTQ and ICTK previously expanded a May 2025 MoU into a US$15 million development and joint investment agreement to co-develop QCIM with ICTK’s VIA PUF technology.
Ticker impact
BTQ says it completed design of its next-generation QCIM plus PUF security chip and is preparing for production, with test chips targeted by year-end.
Mildly positive bias, with follow-through risk tied to test-chip performance and any subsequent tape-out or certification updates.
The release is a primary company milestone (design completion, production preparation, test chips by year-end) but lacks financial guidance, customer names, or quantified performance results.
Market effects
Supports the narrative of hardware-rooted post-quantum security and PUF-based secure elements moving toward deployable silicon.
Highlights Korea-based secure-element/PUF partner ICTK and potential Korea quantum-security commercialization read-through.
Aligns with U.S. executive-order momentum toward post-quantum adoption in federal and critical-infrastructure systems.
Counterpoint
Design completion may not translate into revenue until tape-outs, certifications, and mass-production contracts materialize; the market may discount progress without performance data.
Key entities
- public_companyBTQ Technologies Corp.
Nasdaq-listed quantum security company announcing completion of next-generation QCIM plus PUF chip design.
- public_companyICTK Co., Ltd.
KOSDAQ-listed secure element chip company providing VIA PUF technology for the integrated security chip.
- technologyVIA PUF
ICTK’s physically unclonable function technology used to generate hardware-rooted unique identities.
- technologyQCIM
BTQ’s Quantum Compute-in-Memory security IP intended to accelerate classical and post-quantum cryptographic functions.


