Kioxia, SanDisk show off the tiny chip which could go in world's first 1 PB SSD
SanDisk, working with Kioxia, unveiled a 10th-generation QLC 3D flash memory chip using CMOS directly Bonded to Array technology. The companies say it reaches a 4.8 GB/s interface in tests and offers 60% higher bit density than the prior generation. They cite 37 Gb/mm² density as enabling 1 PB SSDs for data centers, with potential 1 PB drives shipping in 2027.
How this was made
The 30-second read
Why it matters
The newest concrete facts are the claimed 4.8 GB/s interface (under test conditions), 60% bit-density improvement vs the 8th generation, and the stated feasibility path toward 1 PB SSDs for 1U/2U rack servers, with a possible 2027 shipment window.
Market read
This is a technology milestone for enterprise flash density and bandwidth, but it is not accompanied by financial guidance, customer contracts, or confirmed production ramp details.
What to watch
The article cites test-condition interface speed and a speculative 2027 shipping date; traders may need confirmation on yields, controller compatibility, reliability/latency targets, and actual customer design wins.
Background
The piece frames QLC 3D flash as a path to higher capacity and better energy efficiency, using CMOS directly Bonded to Array (CBA) and 10th-generation QLC 3D NAND.
Ticker impact
SanDisk unveiled the QLC 3D flash chip with a 4.8 GB/s interface under test conditions and claims it could enable 1 PB SSDs for data centers.
Moderate, if any, immediate price impact; traders may watch for follow-on announcements tied to customer qualification and volume production.
The article provides performance/density metrics and a potential 2027 shipping window, but no binding customer commitments, pricing, or financial guidance.
Market effects
Highlights a competitive push in QLC NAND density and bandwidth, potentially intensifying the enterprise SSD roadmap race versus Samsung’s higher-layer approach.
No specific regional demand or policy linkage is provided.
If realized, 1 PB SSD capability could support next-generation AI data-center storage architectures globally, but commercialization is not confirmed.
Counterpoint
A 1 PB SSD based on this chip is described as not practical for home systems and requires advanced packaging; without customer qualification and volume economics, the market may discount the timeline.
Key entities
- companySanDisk
Announced the 10th-generation QLC 3D flash chip co-developed with Kioxia, targeting 1 PB SSDs for data centers.
- companyKioxia
Co-developed the QLC 3D flash memory technology using CMOS directly Bonded to Array (CBA).
- companySamsung
Named as the main competitor using more layers in ultra-tall stacks, but no new Samsung-specific event is disclosed.
