$AMD

NVIDIA’s CoWoS AI Chip Packaging Demand To Be Foreshadowed In 2027 By AMD Due To Agentic AI CPU Ramp, Says Morgan Stanley

Morgan Stanley reports TSMC's CoWoS packaging capacity allocation to AMD will rise in 2027, while NVIDIA's share drops. AMD's demand is expected to grow 308% to 530,000 wafers, driven by EPYC and MI400 chips, while NVIDIA's demand grows 57% to 1.2 million wafers. NVIDIA's Vera Rubin CPUs and AMD's EPYC Venice CPUs are expected to see significant shipments in 2027.

Original reporting
Published Aug 25, 2026, 1:00 PM UTC
Analysis
alphai AI DeskAI-generated
Added to alphai Aug 25, 2026, 1:31 PM UTC. Informational, not investment advice.
How this was made
alphai summarizes source reporting and applies a structured AI analysis for relevance, timing, sentiment and ticker impact. Always verify material claims with the original publisher.
NVIDIA’s CoWoS AI Chip Packaging Demand To Be Foreshadowed In 2027 By AMD Due To Agentic AI CPU Ramp, Says Morgan Stanley — source image
Decision brief

The 30-second read

$AMDBullishMed
01

Why it matters

The forecast provides fresh quantitative guidance on advanced packaging demand, a key input for valuation models of both AMD and NVIDIA.

02

Market read

The report reshapes expectations for AI server chip demand and could influence investor positioning in AMD, NVIDIA, and related semiconductor supply chain stocks.

03

What to watch

Potential supply constraints, geopolitical risks to Taiwan, and the impact of alternative packaging technologies not covered in the forecast.

Relevance 7/10Novelty 7/10Timing: 2027 outlook forecast released today

Background

Morgan Stanley released a new research note projecting CoWoS packaging demand through 2027, focusing on AMD's AI-driven growth versus NVIDIA's relative share decline.

Company-level read

Ticker impact

$AMDBullishMedium confidence
Context

Morgan Stanley forecasts AMD's CoWoS demand to jump 308% to 530,000 wafers in 2027, driven by EPYC Venice CPUs and AI GPU ramp.

Expected impact

Potential upside of 5‑10% over the next 12‑18 months as investors price in higher packaging demand.

Evidence & confidence

The forecast is a fresh analyst estimate with large percentage growth, but actual execution depends on TSMC capacity and AI market adoption.

$NVDANeutralMedium confidence
Context

Morgan Stanley expects NVIDIA's share of TSMC CoWoS allocation to fall to 45.6% in 2027, with wafer demand reaching 1.2 million, a 57% increase year‑over‑year.

Expected impact

Limited impact, possibly a modest 2‑4% downside if market emphasizes share loss.

Evidence & confidence

The absolute demand growth is strong, but the reduced share suggests competitive pressure from AMD.

Market effects

Highlights accelerating demand for advanced chip packaging in AI servers, benefiting the broader semiconductor equipment and foundry sector.

May boost Taiwan's TSMC capacity utilization and reinforce Taiwan's role in AI supply chains.

Signals shifting competitive dynamics between AMD and NVIDIA in the AI hardware market worldwide.

Counterpoint

If AI demand stalls or TSMC capacity expands faster than expected, AMD's projected share gain could be overstated, limiting upside.

Key entities

  • Morgan Stanley

    Provider of the forecast data.

  • TSMC

    Allocates CoWoS capacity to AMD and NVIDIA.

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NVIDIA’s CoWoS AI Chip Packaging Demand To Be Foreshadowed In 2027 By AMD Due To Agentic AI CPU Ramp, Says Morgan Stanley — alphai