SK hynix Targets HBM Mass-Production in Indiana Fab by 2028

TrendForce projects memory (DRAM/NAND) will account for 68% of cloud hardware spending by 2027, up from 47% in 2023. NVIDIA plans a 15% price hike for AI servers in 2027, citing memory cost increases. High Bandwidth Memory (HBM) demand is driving supply shifts and price surges, with major suppliers like Samsung, SK Hynix, and Micron benefiting. NVIDIA's price increase is justified by memory's growing share of server costs, impacting cloud providers' budgets.

SK Hynix began construction on a $4B memory packaging plant in Indiana, its first U.S. base, with production starting in late 2029. The plant, supported by U.S. CHIPS Act funding, will employ about 1,000 people and focus on high-bandwidth memory packaging. Meanwhile, Intel canceled a similar plant in Europe last year.

SK hynix began a $3.87B project in Indiana to produce HBM, with mass production starting in 2029. The facility will process DRAM wafers for high-performance memory used in AI accelerators. The US government will provide $458M in funding and $500M in loans under the CHIPS Act. The project is expected to create 7,000 jobs.

SK Hynix plans to start volume production of HBM4E chips at its Indiana facility in Q3 2029, with annual capacity reaching hundreds of thousands of wafers. The $4B project aims to meet AI-driven demand and serve customers like Nvidia, Microsoft, and Google. The company expects Indiana to become a key U.S. HBM production base by 2030, with the facility also housing an AI semiconductor R&D center. SK Hynix held 58% of the global HBM market in Q1 2026, according to Counterpoint Research.

Nvidia reported strong earnings, citing memory as a bottleneck. It expects gross margins to compress to 71-72% due to higher memory costs, benefiting memory makers like SK Hynix, Samsung, and Micron. Memory stocks rallied, with SK Hynix up 2.49%, Samsung up 1.72%, Kioxia up 5.00%, and SanDisk down 1.54%. Moody's upgraded SanDisk to Ba1, citing strong revenue growth prospects.

SK Hynix began constructing a $4B AI chip packaging facility in Indiana, aiming to meet rising demand for memory chips. The site, set to open in 2028, will produce high-bandwidth memory (HBM) and house an AI semiconductor R&D center. SK Hynix holds 58% of the global HBM market, per Counterpoint Research. The project is backed by U.S. grants and loans under the CHIPS Act.