Samsung Pushes ASML’s High NA EUV for Next-Gen Chipmaking

Samsung Electronics and SK Hynix rose modestly on Sept. 9, driven by U.S. semiconductor gains, with Samsung up 0.19% and SK Hynix up 1.17%. The Philadelphia Semiconductor Index climbed 1.3%, with Intel, AMD, Broadcom, and Seagate also rising. Oil price surges limited broader market gains.

Samsung Electronics (005930) may buy back GDRs, potentially reducing the discount on preferred stock. The company led a €3B funding round for Mistral AI, valuing it at ~€21B. The South Korean government plans to invest in chipmaking and AI data centers, involving Samsung.

Samsung Electronics partnered with Mistral AI to develop AI models for semiconductor design and manufacturing. The collaboration focuses on integrating Mistral's language models into Samsung's operations. Samsung also invested in Mistral's Series D funding round, valuing the company at over 21 billion euros. Both companies aim to enhance semiconductor efficiency and competitiveness through AI.

TSMC, Samsung, and Intel have committed to purchasing ASML's $400 million High-NA EUV machines for advanced chip production. TSMC plans adoption by 2030, Samsung by 2028, and Intel is already using the technology. The companies also agreed to upgrade to 12-inch photomasks to boost output and reduce costs. ASML's shares have a Strong Buy consensus with a 44% upside target.

TSMC and Samsung have committed to using ASML's High NA EUV lithography machines, costing around $400 million each, for advanced chip production. Samsung plans to use them for DRAM from 2028, while TSMC expects increased demand driven by AI. ASML's stock has risen 120% in the past year, with Barclays calling the news a positive. ASML will add 30% EUV capacity in 2027, and all three companies will collaborate on next-gen photomask technology.

Samsung Electronics is collaborating with ASML to develop 12-inch photomasks for advanced semiconductor manufacturing, aiming to improve productivity and reduce costs. The new masks will support High-NA EUV lithography systems for ultra-fine processes, with Samsung planning to be the first to use them in mass DRAM production by 2028. The shift from 6-inch masks is driven by the increasing complexity of AI semiconductor circuits.