Ceva and LG Validate First Full-Stack UWB IP on TSMC 22nm: Anchor Customer Already Licensing
Ceva, Inc. and LG Electronics announced a collaboration on September 9, 2026, to develop a complete ultra-wideband (UWB) subsystem on TSMC's 22nm process. An unnamed U.S. semiconductor company has already licensed the technology. The system is designed to comply with the upcoming IEEE 802.15.4ab standard, which is expected to enhance UWB's ranging distance and sensing capabilities. The partnership aims to reduce integration risks for SoC teams, particularly in the automotive sector, where UWB is
How this was made

The 30-second read
Why it matters
The validated stack reduces integration risk for OEMs, potentially shortening time‑to‑market for UWB‑enabled vehicles and devices.
Market read
First validated full‑stack UWB IP could unlock new automotive licensing revenue, but impact remains niche.
What to watch
Regulatory approvals and automotive certification timelines could delay commercial rollout.
Background
UWB technology is transitioning from secure ranging (802.15.4z) to broader positioning and radar functions under the upcoming 802.15.4ab standard.
Ticker impact
Ceva announced a collaboration with LG to deliver the first full‑stack UWB IP on TSMC's 22nm process, a first‑time validation that could drive licensing revenue.
upside potential if licensing deals materialize, modest short‑term price lift expected.
New licensing validation is primary news, but scale is limited to UWB niche; market reaction likely modest.
Market effects
Could accelerate adoption of UWB in automotive and consumer devices, benefiting broader semiconductor and sensor sectors.
Primarily impacts U.S. and Asian UWB ecosystem players.
Limited to niche UWB market; not a broad market mover.
Counterpoint
UWB adoption may be slower than projected; existing competitors could retain market share.
Key entities
- CompanyCeva, Inc.
Chip IP specialist developing UWB stack.
- CompanyLG Electronics
Partner providing RF front‑end and integration.
- CompanyTSMC
Foundry offering 22nm ultra‑low‑power process.



