Taiwan Semiconductor’s August Revenue Rose 53% To Record High

ASML, Intel (INTC), TSMC (TSM), and Samsung (005930.KS) collaborate to adopt High-NA EUV, a next-gen lithography tech. Samsung aims to use it in DRAM by 2028, TSMC by 2030. Intel is already using it. They also plan to jointly develop 12-inch photomasks. This follows China's advancements in DUV tech, which impacted ASML's share price.

Broadcom (AVGO) benefits from hyperscalers designing custom AI chips, while TSM (TSM) profits from manufacturing these chips. TSM reported record August revenue of NT$514.81 billion, up 53.3% YoY. Both companies face risks like customer concentration and rising costs.

TSM reported August revenue of NT$514.81 billion, up 53.3% YoY, and 39.3% growth for the first eight months of 2026. NVDA benefits from TSM's demand but faces pricing pressure. TSM's pricing power could impact NVDA's margins. Hedge funds increased holdings in both TSM and NVDA in Q2.

TSM reported record August revenue of NT$514.81 billion, up 53.3% YoY and 10.1% sequentially. AMD, reliant on TSM for advanced manufacturing, faces potential cost increases if TSM raises chip prices. AMD's growth depends on AI accelerator market share, but higher foundry costs could impact its pricing power. Hedge funds increased holdings in both TSM and AMD in Q2.

TSMC reported record revenue of $16B in August, up 53% YoY, driven by AI chip demand. This supports Nvidia's strong position in AI, with over 90% of its revenue from data center sales. Nvidia's stock has surged 900% in five years, but concerns about an AI slowdown have weighed on it recently.

Intel shares rose 3% on reports of a potential 10% price hike for PC processors, extending its 183% YTD gain. AMD and Taiwan Semiconductor also saw gains, but Intel's move was stock-specific. Piper Sandler initiated coverage with a Neutral rating and $110 target, citing execution risks and data center competition.