GlobalFoundries and Monolithic Power Systems form manufacturing partnership to scale high-performance power solutions

The U.S. Commerce Department has taken equity stakes in 40 companies, including Intel (INTC), GlobalFoundries (GFS), and MP Materials (MP), as part of CHIPS Act research awards. Intel's stake is valued at $40.6B, while GlobalFoundries' is around $1.8B. MP Materials has a 10-year price floor agreement. Government ownership may reduce risk but also dilutes shares and limits upside.

TSMC (2330) will raise CoWoS packaging prices by 10–20% due to high AI demand and limited capacity. The company expects production to exceed 130,000 units monthly by 2026 and 200,000 by 2027, with clients including Nvidia, AMD, and Apple. GlobalFoundries will manufacture interposers in the U.S. for TSMC's CoWoS packaging.

The U.S. and Japan agreed to a $21B deal for two chip factories at GlobalFoundries' Saratoga County campus. The U.S. will hold a 7% stake, estimated at $2B. Factories, costing $10B each, will boost wafer production and jobs. A third factory may be decided by 2028.

Japan is investing $21B to build two chip plants at GlobalFoundries' New York campus. Officials highlight the project's importance for national security and supply chain resilience.

GlobalFoundries Inc. plans to build two chip plants in New York with $21B in financing from Japan. The deal was enabled by a U.S.-Japan trade agreement. The company received prior federal funding, which will now be redirected. President Trump stated the U.S. will receive shares in GlobalFoundries. The investment aims to boost U.S. semiconductor manufacturing and supply chains.

GlobalFoundries (GFS) secured a $2B deal with TSMC (TSM) to manufacture silicon interposers, starting production in 2028. Intel and Corning are also involved in advanced packaging for AI accelerators. The deal represents ~5.6% of GFS's 2026 annualized revenue, offering growth opportunities in AI infrastructure.