Goldman Sachs Research Report Analysis: SK hynix HBM Pricing Rises, LTA Locks in Demand
Goldman Sachs reaffirmed its Buy rating for SK Hynix with a 12-month target price of KRW 3,500,000, citing an 87.4% upside potential due to tight HBM and DRAM supply. The firm expects pricing and profit margins to rise through 2027, supported by Long-Term Agreements. SK Hynix anticipates sequential quarterly pricing growth driven by tight supply and a higher-end HBM mix. Goldman Sachs projects EPS growth and believes current valuations underestimate sustained HBM pricing upside.
How this was made

The 30-second read
Why it matters
The report introduces fresh EPS forecasts and a large upside target, providing a new catalyst for the stock.
Market read
Analyst upgrade with a high upside target may drive buying interest and price appreciation for SK Hynix.
What to watch
Exchange‑rate volatility and potential slowdown in AI capex could temper earnings growth.
Background
Goldman Sachs released an analyst report on SK Hynix, reaffirming a Buy rating and setting a new 12‑month target price.
Ticker impact
Goldman Sachs reaffirmed a Buy rating on SK Hynix with an 87.4% upside target price of KRW 3,500,000 and new EPS forecasts through 2028.
Potential price rally toward the KRW 3.5M target over the next 12 months.
The report provides fresh earnings forecasts, a sizable price target, and highlights tight HBM/DRAM supply, all of which are new catalyst material for traders.
Market effects
Tight HBM and DRAM supply may lift other memory manufacturers and related AI hardware stocks.
Positive outlook for South Korean semiconductor sector and potential inflows into KRX memory stocks.
Higher memory pricing could benefit global AI and data center equipment providers.
Counterpoint
If HBM demand softens or Samsung accelerates its own HBM line, SK Hynix may miss the projected upside.
Key entities
- companySK Hynix
South Korean memory chip maker, subject of the analyst report.
- research_firmGoldman Sachs
Issuer of the new Buy rating and target price.
