GlobalFoundries unveils 7nm-class FDX Fusion chip platform with 2028 Dresden manufacturing target

GlobalFoundries (GFS) announced its FDX Fusion FD-SOI platform, set for 2028 production in Dresden. The tech aims for 2x density improvement over prior versions, targeting automotive, industrial, and edge computing markets. Early customer evaluations begin in 2027. Partners include BMW, Bosch, Infineon, NXP, Siemens, and Tesla.

GlobalFoundries (GFS) marked a milestone in its €1.1 billion Dresden expansion, aiming to increase wafer production capacity to over 1 million annually by 2028. The company also announced FDX Fusion, a next-generation platform for energy-efficient chips designed for Physical AI applications. GFS expects the expansion to support automotive, aerospace, and industrial IoT markets, reinforcing its role as a trusted semiconductor partner in Europe.

GlobalFoundries (GF) and TSMC have agreed on a five-year deal for GF to produce silicon interposers in Malta, New York, for TSMC's CoWoS advanced packaging, supporting AI chips. Production is set to begin in early 2028, with potential scaling for future demand. According to GF, this partnership strengthens the US semiconductor supply chain and supports AI innovation.

GlobalFoundries (GF) and TSMC agreed on a $2bn deal for GF to supply silicon interposers from its New York facility. The multi-year agreement supports advanced packaging for AI and high-performance computing. GF plans to expand its fabrication capacity to meet growing demand. The deal's initial term is five years, with provisions for capacity expansion. Volume production is expected to begin in early 2028.

GlobalFoundries and TSMC agreed on a $2B deal to produce silicon interposers in the US, addressing a domestic semiconductor supply chain gap. The interposers will be used in TSMC's CoWoS packaging for customers like Nvidia. Production is set to begin in 2028, with Intel Foundry offering an alternative for earlier US-based packaging needs.

TSMC has agreed to a $2 billion deal with GlobalFoundries to supply silicon interposers. The agreement highlights collaboration between the two semiconductor manufacturers. TSMC's stock closed at 2,550 TWD, down 1.35% for the day but up 64.52% year-to-date.