GlobalFoundries signs $2 billion five‑year deal to produce silicon interposers for TSMC
GlobalFoundries will manufacture silicon interposers for TSMC’s CoWoS advanced‑packaging system at its Malta, New York plant. The agreement is valued at $2 billion over five years and calls for volume production to start in the first half of 2028. The deal creates a U.S.‑based source of these critical components for AI and high‑performance‑computing chips. Capacity will be expanded at the New York facility and the contract includes a framework for future expansion.
Why it matters
The company says the $2 billion agreement represents roughly 5.6 % of GlobalFoundries’ 2026 annualized revenue, providing a material near‑term revenue boost. For TSMC, the deal secures a domestic supply of interposers, reducing reliance on overseas packaging and strengthening its U.S. supply chain.
Key facts
- 1The agreement is valued at $2 billion over five years. silicon.co.uk
- 2Volume production of silicon interposers is expected to begin ramping in the first half of 2028. silicon.co.uk
- 3GlobalFoundries will expand capacity at its Malta, New York plant for the interposer production. silicon.co.uk
- 4The contract has an initial five‑year term. neoteo.com
- 5The $2 billion deal equals about 5.6 % of GlobalFoundries’ second‑quarter 2026 revenue annualized over four quarters. drrobertcastellano.substack.com
Summary written by AlphAI AI Desk from 3 of 3 sources. Not investment advice. Figures are as stated by the linked sources.