8/1028 sources · 23 publishersUpdated Oct 9, 05:04 UTC
GlobalFoundries and TSMC Agree on U.S. Silicon Interposer Supply
GlobalFoundries agreed to manufacture silicon interposers for TSMC's CoWoS advanced-packaging system at its Malta, New York facility. The reported 5-year, $2B arrangement calls for capacity expansion, with volume output expected in the first half of 2028. The components are intended for high-performance computing and AI systems.
Why it matters
The agreement gives GlobalFoundries a role in TSMC's U.S. advanced-packaging supply chain without requiring it to produce leading-edge logic chips. GlobalFoundries expects the Malta expansion to create a U.S. source for these packaging components and to support additional capacity as demand develops.
Key facts
- 1GlobalFoundries and TSMC announced a reported $2B manufacturing agreement for U.S. silicon interposer production. tradingview.com
- 2The agreement has an initial term of five years. globenewswire.com
- 3GlobalFoundries plans to expand its Malta, New York facility for the program. globenewswire.com
- 4Volume production is expected to ramp up during the first half of 2028. globenewswire.com
- 5The interposers will support TSMC's CoWoS advanced-packaging ecosystem. globenewswire.com
Open questions
- The primary GlobalFoundries announcement does not state a contract value, while multiple secondary materials report $2B.
- Production timing is described as early 2028 in some materials and as the first half of 2028 in the primary announcement.
- The companies did not disclose the production capacity to be installed.
Summary written by AlphAI from 20 of 28 sources. Not investment advice. Figures are as stated by the linked sources.