Nvidia expands advanced packaging partnership with Amkor, signing $3 billion multi‑year agreements

Nvidia announced a major expansion of its advanced packaging partnership with Amkor Technology, targeting a more than 300% increase in interposer wafer capacity in South Korea by the end of 2028. The two companies also signed multi‑year capacity agreements worth $3 billion to support AI and computing platform packaging in Arizona and South Korea. Amkor’s stock jumped 8% on the news.

The share price of Amkor rose 8% after the announcement, reflecting investor optimism about the revenue upside from the expanded capacity deals. The $3 billion commitment signals a long‑term revenue stream for Amkor and helps Nvidia secure supply for its AI hardware growth.

  • 1Nvidia aims to boost interposer wafer capacity in South Korea by more than 300% by the end of 2028.
  • 2Nvidia and Amkor signed multi‑year capacity agreements totaling $3 billion.
  • 3Amkor shares surged 8% following the announcement.
  • 4Nvidia is providing a $1.1 billion capacity‑reservation advance to KYEC for new U.S. testing facilities, targeting high‑volume production by April 2027.
  • 5The $3 billion agreements cover expansion of AI and computing platform packaging in Arizona and South Korea.

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