TSMC signs $2 billion five‑year interposer supply deal with GlobalFoundries
Taiwanese contract chipmaker TSMC will buy silicon interposers from U.S. foundry GlobalFoundries for AI chip packaging. The agreement is valued at $2 billion over five years and calls for mass production to start in the first half of 2028 at GlobalFoundries’ Malta, New York plant. The move shifts a key component of TSMC’s CoWoS advanced‑packaging technology from Taiwan to the United States and could pressure Korean memory suppliers such as SK hynix.
Why it matters
The contract expands the U.S. supply chain for AI chips, reducing reliance on Taiwan and potentially increasing demand for locally produced high‑bandwidth memory. Investors in TSMC and GlobalFoundries may see revenue growth from the new interposer sales, while Korean memory makers could face competitive pressure to localize production.
Key facts
- 1The contract is worth $2 billion over five years. en.sedaily.com
- 2Mass production of silicon interposers is scheduled for the first half of 2028. en.sedaily.com
- 3GlobalFoundries will expand production at its Malta, New York plant for the interposers. en.sedaily.com
- 4The deal could affect Korean memory makers such as SK hynix, which is building an advanced packaging plant in Indiana for HBM. en.sedaily.com
Summary written by AlphAI AI Desk from 2 of 2 sources. Not investment advice. Figures are as stated by the linked sources.