TSMC to list NT$14.8 billion green bonds on Nov 12

Taiwan Semiconductor Manufacturing Co. will list green bonds worth NT$14.8 billion (US$450 million) on 12 November. The issue consists of NT$12.4 billion of five‑year bonds at a 2.30% coupon and NT$2.4 billion of ten‑year bonds at a 2.42% coupon. Taishin Securities is the lead underwriter and Taipei Fubon Commercial Bank is the trustee. Proceeds will be used for green building and environmental protection projects and form part of TSMC’s planned NT$60 billion bond programme for 2026.

The bond issuance adds to TSMC’s NT$60 billion bond sales plan, providing financing for its production expansion and sustainability initiatives. Investors will see a new fixed‑income offering from the world’s largest contract chipmaker, potentially influencing its credit profile and demand for its debt.

  • 1TSMC will list green bonds worth NT$14.8 billion (US$450 million) on 12 November.
  • 2The issue comprises NT$12.4 billion of five‑year bonds with a 2.30% coupon.
  • 3It also includes NT$2.4 billion of ten‑year bonds with a 2.42% coupon.
  • 4Taishin Securities Co. is the lead underwriter and Taipei Fubon Commercial Bank Co. is the trustee.
  • 5The green bond issue is part of TSMC’s planned NT$60 billion bond sales for 2026.
  • 6Outstanding green bonds issued by TSMC total NT$229.1 billion.

Sources