Xiaomi launches new Xring chip, partners with TSMC for production, sources say
Xiaomi unveiled the Xring O3 chip, its second in-house smartphone processor, aiming to strengthen its supply chain. TSMC will manufacture the chip using 3-nanometre technology, according to sources. The chip may power Xiaomi's upcoming folding phone, with shipment targets of 200,000-300,000 units. Xiaomi's Xring O1 chip has surpassed 1 million cumulative shipments across devices. Xiaomi and TSMC did not comment on the specifics.


