Samsung to use TSMC's 3nm process for Nvidia's next-gen AI memory chips
Samsung will use TSMC's 3nm process for Nvidia's next-gen AI memory chips, marking a shift from its in-house model. Nvidia requires TSMC's 3nm process for base dies and 6th-gen DRAM for core dies. Samsung accepted to secure its supply chain position but will keep its own processes for other products.
How this was made

The 30-second read
Why it matters
The deal signals growing demand for cutting‑edge process nodes in AI memory, potentially benefiting fab companies and reinforcing Nvidia's product roadmap.
Market read
The announcement could lift Samsung and TSMC shares as investors price in new high‑margin AI memory business, while Nvidia remains neutral.
What to watch
Potential cost premium of using TSMC versus Samsung's own process and the risk of supply bottlenecks.
Background
The article announces a strategic shift for Samsung, which historically used its own fabs for memory dies, now leveraging TSMC's leading‑edge 3nm technology to meet Nvidia's AI memory specifications.
Ticker impact
Samsung Electronics agreed to use TSMC's 3nm process for Nvidia's next‑gen AI memory base dies, a new strategic partnership.
likely upward pressure as investors price in new high‑margin contract
First disclosure of a major deal with TSMC and Nvidia; Samsung gains a premium‑tech source for a high‑growth segment.
TSMC will provide its 3nm process for Samsung‑produced base dies for Nvidia's custom NVHBM chips.
likely supportive price action as the contract expands TSMC's AI‑related wafer business
New contract with Samsung for Nvidia chips signals growing demand for TSMC's leading‑edge node.
Nvidia specified that its memory partners must use TSMC's 3nm process for the base dies of its upcoming NVHBM lineup.
minimal immediate effect; market already expects Nvidia to secure advanced packaging partners
The article reports Nvidia's technical requirement, not a new financial transaction for Nvidia.
Market effects
Strengthens the AI‑hardware supply chain, highlighting demand for advanced nodes in memory and compute.
Boosts South Korean and Taiwanese fab sectors; may lift related semiconductor equities in Asia.
Reinforces confidence in the AI memory market, a key growth driver for global tech stocks.
Counterpoint
The partnership could expose Samsung to TSMC capacity constraints, limiting upside.
Key entities
- CompanySamsung Electronics
South Korean semiconductor giant entering a partnership with TSMC for Nvidia memory chips.
- CompanyTSMC
World's leading contract chipmaker providing 3nm process for the new AI memory base dies.
- CompanyNvidia
Designer of the upcoming NVHBM AI memory, setting technical requirements for its partners.



