Samsung to use TSMC tech for Nvidia’s next-generation memory chips, says Seoul newspaper
Samsung Electronics plans to use TSMC’s 3nm process for Nvidia’s next-gen HBM chips, per Seoul Economic Daily. Nvidia requested Samsung, SK Hynix, and Micron use TSMC for NVHBM base dies. Samsung will keep in-house production for standard HBM. TSMC may face capacity challenges, per sources.
How this was made
The 30-second read
Why it matters
The deal signals strong demand for advanced process technology in AI hardware, potentially lifting Samsung and TSMC shares while offering Nvidia supply flexibility.
Market read
The announcement underscores the growing importance of advanced node capacity for AI workloads and may influence investor sentiment across the semiconductor sector.
What to watch
Potential capacity constraints at TSMC could delay Nvidia's HBM rollout.
Background
The article reports a newly disclosed collaboration where Samsung will use TSMC's cutting‑edge 3nm process for Nvidia's next‑generation high‑bandwidth memory, a first‑of‑its‑kind arrangement.
Ticker impact
Nvidia has asked Samsung, SK Hynix and Micron to use TSMC's process for its next‑gen HBM, confirming a multi‑supplier strategy.
minimal immediate move; long‑term benefit from secured supply of advanced HBM.
The announcement confirms Nvidia's supply plan but does not change its revenue outlook directly.
TSMC's 3‑nanometre process will be used by Samsung to produce Nvidia HBM base dies, marking TSMC's first involvement at this manufacturing stage.
potential modest upside as investors view the expanded TSMC footprint.
Being selected for a critical Nvidia component highlights TSMC's technology leadership.
Market effects
Strengthens the AI‑hardware and advanced‑node foundry sector, highlighting demand for 3nm capacity.
Boosts sentiment for South Korean and Taiwanese semiconductor exporters.
Reinforces the supply chain narrative for AI chips worldwide.
Counterpoint
The partnership may pressure Samsung's own memory business margins if TSMC pricing is higher.
Key entities
- CompanySamsung Electronics
South Korean semiconductor giant securing Nvidia HBM contract.
- CompanyNvidia
AI chipmaker developing next‑gen HBM with multi‑supplier strategy.
- CompanyTSMC
Taiwanese foundry providing 3nm process for the HBM base dies.
