3 Chip Stocks Set to Win TSMC’s Packaging Boom
TSMC's expansion in advanced packaging for Nvidia and others drives demand for inspection equipment from KLA, Camtek, and Nova. Nvidia-driven CoWoS wafer demand is projected to rise 125% by 2027. Camtek leads near-term growth with 75% revenue from advanced packaging and $600M in orders booked through July 2026. KLA offers broad exposure, while Camtek and Nova provide specialized leverage.




