Broadcom secures multibillion‑dollar financing from banks and Blackstone to lease AI chips to Anthropic

Broadcom announced a financing structure worth billions of dollars to fund the purchase of its XPU AI accelerators and networking gear for Anthropic. Bank of America, Citi and Morgan Stanley will arrange the first‑lien senior loan, while Blackstone will provide the committed second‑lien tranche. Broadcom will back the senior debt with residual‑value support equal to the first‑lien amount, and equipment deliveries are slated to begin in calendar 2027.

The deal gives Broadcom a large, off‑balance‑sheet order that should boost its AI‑chip revenue once deliveries start, while the financing reduces Anthropic’s upfront capital needs. The senior‑debt backstop also lowers credit risk for the banks, potentially encouraging further AI‑infrastructure financing.

  • 1The transaction totals $63 billion in financing.
  • 2Bank of America, Citi and Morgan Stanley are arranging the first‑lien senior financing.
  • 3Blackstone is the sole committed provider of the second‑lien tranche.
  • 4Broadcom will provide residual‑value support equal to the first‑lien portion of the financing.
  • 5The equipment is expected to be delivered starting in calendar 2027.
  • 6Anthropic filed for an IPO on the same day, targeting a valuation of $1.5 trillion‑$2 trillion.
  • Some sources cite a $64 billion financing amount, while the primary announcement states $63 billion.

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