Banks and Blackstone arrange $63 billion financing for Broadcom AI chips to be leased to Anthropic
Bank of America, Citi and Morgan Stanley are arranging the first‑lien senior debt, while Blackstone will provide the committed second‑lien tranche in a $63 billion financing vehicle. Broadcom will supply XPU AI accelerators and networking solutions and will back‑stop the senior debt with residual‑value support equal to the first‑lien amount. The equipment is slated for delivery beginning in calendar 2027, and Anthropic filed for an IPO on the same day.
Why it matters
Broadcom says the financing validates market capital for AI compute and secures a large future order. The banks and Blackstone will earn fees from arranging and providing the debt. Anthropic gains guaranteed compute capacity ahead of its IPO.
Key facts
- 1Total financing arranged is $63 billion. prnewswire.com
- 2A newly formed special purpose vehicle will purchase Broadcom XPU AI accelerators and networking solutions. prnewswire.com
- 3Bank of America, Citi and Morgan Stanley are arranging the first‑lien senior financing. prnewswire.com
- 4Blackstone is the sole committed provider of the second‑lien financing. prnewswire.com
- 5Broadcom will provide residual‑value support to the SPV in an amount equivalent to the first‑lien portion. prnewswire.com
- 6Deliveries of the equipment are expected to begin in calendar 2027. prnewswire.com
Open questions
- The exact size of the first‑lien senior debt is reported as about $43.5 billion in material 7, but no other source discloses the amount.
Summary written by AlphAI AI Desk from 11 of 12 sources. Not investment advice. Figures are as stated by the linked sources.