Lee Chun-Hsien purchased $4K of TSM (indirect holdings)

The Nasdaq Composite fell 1.88% to 26,692.87 on October 14, 2026, driven by higher-than-expected inflation data and a warning from ASML about semiconductor demand. Key tech stocks like AMD, Micron, and Nvidia declined, while Apple rose 0.3%. The index is now 3.7% below its 52-week high.

GlobalFoundries (GF) and TSMC have agreed to manufacture silicon interposers in the US, supporting TSMC's CoWoS advanced packaging ecosystem. This deal aims to strengthen the US AI supply chain, particularly for high-bandwidth memory (HBM) solutions.

GlobalFoundries and TSMC agreed on a $2B deal to produce silicon interposers in the US, with production starting in 2028. The expansion at GlobalFoundries' New York facility will support TSMC's advanced chip packaging technology, crucial for AI and high-performance computing.

TSMC may reach its 2027 2nm production target of 110,000-140,000 wafers/month a year early, now aiming for 120,000 wafers/month by 2026 end. Strong demand from NVIDIA, AMD, Apple, and Qualcomm is driving this acceleration, according to reports. Bank of America expects 2nm's revenue contribution to jump from 3% to 11% in Q3.

GlobalFoundries and TSMC signed a $2 billion deal to produce silicon interposers in the U.S. for AI packaging. GF will expand its New York facility, with production starting in early 2028. The agreement aims to support growing demand for high-performance computing and AI systems, according to GF.

Shares of AI chipmakers fell in Asia and U.S. premarket trading on Tuesday. SK Hynix and Samsung dropped 10.1% and 7.4%, respectively, while U.S. peers like Nvidia and AMD also declined. Broadcom's CEO warned about unrealistic AI investment expectations. Chinese chipmaker CXMT announced advancements in RAM chip technology, potentially challenging major rivals.