Samsung Electronics pushes to adopt TSMC 3nm process for Nvidia’s next-gen HBM
Samsung Electronics plans to use TSMC's 3nm process for Nvidia's next-gen HBM chips, marking a first-time collaboration with its foundry rival. Nvidia requested Samsung, SK Hynix, and Micron to use TSMC's process for base dies and 6th-gen DRAM tech for core dies. Samsung will maintain its in-house production model for other products.
How this was made

The 30-second read
Why it matters
The announcement may lift Samsung's stock and influence memory‑chip pricing dynamics, while underscoring Nvidia's influence on supply‑chain decisions.
Market read
First collaboration between Samsung and TSMC for Nvidia HBM could reshape memory supply dynamics and affect related stocks.
What to watch
Potential cost implications of outsourcing base dies and the impact on Samsung's in‑house HBM roadmap.
Background
Samsung Electronics, a major memory supplier, is aligning with rival TSMC to meet Nvidia's request for advanced HBM production, a first‑of‑its‑kind collaboration.
Market effects
May boost the memory‑chip sector as competitors consider similar collaborations; could pressure rivals like SK Hynix and Micron.
Positive for South Korean equities and the broader Asian tech supply chain.
Highlights growing reliance on TSMC's leading process nodes for advanced AI hardware.
Counterpoint
The partnership could signal Samsung's inability to compete on its own process, potentially eroding its foundry leadership.
Key entities
- CompanySamsung Electronics
South Korean memory and semiconductor manufacturer.
- CompanyTSMC
Taiwanese leading semiconductor foundry.
- CompanyNvidia
Designer of AI chips requiring next‑gen HBM.


