Samsung said to use TSMC tech for Nvidia's next-generation memory chips
Samsung (SSNLF) will use TSMC's (TSM) 3nm process for Nvidia's (NVDA) next-gen memory chips, per Seoul Economic Daily. Nvidia also involves SK Hynix (SKHY) and Micron (MU). This marks Samsung's first HBM manufacturing collaboration with TSMC. Samsung will keep its in-house model for other products.
How this was made

The 30-second read
Why it matters
The partnership may reduce supply risk for Nvidia and showcase Samsung's flexibility, while the financial impact on Samsung is likely limited.
Market read
First‑time collaboration at the HBM base‑die level could influence supply dynamics for AI hardware, modestly affecting Nvidia and Samsung stocks.
What to watch
Pricing terms of the TSMC contract and potential capacity constraints are not disclosed, which could affect the actual impact.
Background
The article reports a new manufacturing collaboration between Samsung Electronics and TSMC for Nvidia's custom HBM chips, marking Samsung's first use of TSMC at this stage.
Ticker impact
Nvidia has asked Samsung, SK Hynix and Micron to use TSMC's 3nm process for its custom HBM chips.
modest upside as market views the supply diversification favorably.
The news removes a supply‑risk narrative and may support near‑term demand for Nvidia's AI products.
Market effects
Strengthens the advanced‑memory sector by showing cross‑fab collaboration, may prompt other memory makers to seek similar deals.
Korea and Taiwan markets could see modest positive sentiment from the partnership news.
Highlights supply‑chain diversification for AI hardware, relevant to global tech investors.
Counterpoint
The use of TSMC could signal Samsung's own process lag, potentially hurting its competitive edge in memory.
Key entities
- CompanySamsung Electronics
Korean semiconductor giant, ADR ticker SSNLF.
- CompanyTaiwan Semiconductor Manufacturing Co.
World's leading contract chipmaker, TSMC.
- CompanyNvidia
AI chip designer, ticker NVDA.

